Category:Electronic Components BGA

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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uBGA rework and X-Ray inspection Reply 2017-02-27 06:16:12
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tom

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Hello - I am currently evaluating uBGA rework and X-Ray inspection solutions. I would like any advice/warnings etc. regarding suppliers and equipment. I have already researched through the threads in this forum and have created a list of recommended equipment. I am starting with A.T.E. Sniper, Conceptronic Freedom 2000, Air Vac DRS24C, and SRT for the rework staions. Several of the suppliers also offer a x-ray system. Please share your experiences regarding effectivity of product, ease of use, training, service support, hidden costs (i.e. special tooling, etc.), mean time to rework a uBGA device and whatever else I haven't thought of to this point. Thank you in advance.
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Statement: This post is only the personal view of the author and does not represent the opinions of ALLPCB.com.

henrik.svensk

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Basil

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Christopher

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Great article! Keep up the great writing.

Andre Bosshard

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Like this post very much.

William Reeve

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