Category:Electronic Components BGA

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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SMT fine pitch or BGA component Reply 2017-02-27 04:11:15
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Laszlo Toth

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Problem: A SMT fine pitch or BGA component needs to be baked due to MS concerns and is needed in a hurry. In some cases the packaging will not allow a high temp/short duration bake. Production will not allow a low temp/long duration bake. If the parts are removed from a tube/tray/tape for baking, what is the best option for storing them in the baking oven? For BGA's I would think placing them ball side up on a flat surface. What about QFQ's? Any manual handling will probably guarantee that lead coplanarity is compromised. If the leads must rest on a surface, what would be the best material to minimize contamination. I understand that any option is bad, I'm just curious how others handle such a situation.
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Lukas Krehel

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Yucel Calik

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Dennis

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Alejandro Ariel

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Adair

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