Good Morning Everyone,
I had a question regarding the use of a lead free BGA in a leaded process. All of the information I have gathered from various seminars state that this is OK. It will process more like a column grid array where the 63/37 will form the interconnection between the PCB pad and the BGA ball. The idea is that the ball will not become liquids so there is a transition of materials that form the interconnect. Yesterday, a customer visited to discuss out Lead Free roadmap. They stated that they have reliability data that shows that this is not acceptable. Has anyone else heard or know of any data that supports this statement? Any help would be greatly appreciated.
Thanks In Advance
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