Category:Electronic Components BGA

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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Lead free BGA Reply 2017-02-27 01:25:07
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nestandart

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Good Morning Everyone,
I had a question regarding the use of a lead free BGA in a leaded process. All of the information I have gathered from various seminars state that this is OK. It will process more like a column grid array where the 63/37 will form the interconnection between the PCB pad and the BGA ball. The idea is that the ball will not become liquids so there is a transition of materials that form the interconnect. Yesterday, a customer visited to discuss out Lead Free roadmap. They stated that they have reliability data that shows that this is not acceptable. Has anyone else heard or know of any data that supports this statement? Any help would be greatly appreciated.
Thanks In Advance
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Statement: This post is only the personal view of the author and does not represent the opinions of ALLPCB.com.

drka

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I was really confused, and this answered all my qutoiesns.

Antal Levente

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Useful!

Boris Drazic

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Interesting and useful!

ozkan

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Great article! Keep up the great writing.

Amir Aliabadi

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