Category:Electronic Components BGA

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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LF BGA Tests Reply 2017-02-27 01:36:36
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vitri.angelo

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What kind of destructive testing is anyone doing for LF BGAs?
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John

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I certainly enjoyed reading your post.

unbreakablejb

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Your article answered all my puzzles.

Alain

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You did a great job. Really appreciate your content.

Vratislav.michal

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Useful!

henry.kjonsberg

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Good resource for new beginners.
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