Category:Electronic Components BGA

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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Ways to Clean BGA Reply 2017-02-27 23:32:35
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Andy

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Hi We have BGA sockets that are soldered on our PCB which required cleaning? Anyone have any solution as for now we just use compress air jet to clean it. We found this is not effective in the long run. Any comment?
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Toni

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My favorite psot here. Its very impressive and helpful.

ernesto

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Pretty good and useful info for beginners.

Clark

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I am doing a new project. Your posting is pretty good and useful to my job.Thanks a lot. Hope you can write again.

Craig

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Impressive and helpful.

paolo.costanzi

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An interesting post.
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