Category:Electronic Components BGA

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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BGA Stencil Aperture Design Reply 2017-02-25 22:57:32
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theubo

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Hi All,
Just a quick question in relation to BGA Stencil Aperture Design -
We currently use 1:1 ratio - are there any rules or benefits from over printing the PCB Pad ?
Replies appreciated.
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Statement: This post is only the personal view of the author and does not represent the opinions of ALLPCB.com.

alejandro.rostro

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Many thanks. Your idea is very valuable. Will certainly share this post with my pals.
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