Category:Electronic Components BGA

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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BGAs Reply 2017-02-21 12:46:33
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avonchia

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After switching from No-clean flux to Water soluble (Kester)we encountered voids problem (X-ray and microsectioning). Reducing the apperture sizes made the voids smaller but did not eliminate them. So we had to go back to No-clean. Any idea why voids occur? Will appreciate any answer.
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Eibert Draisma

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Bravo! Hope you can write soon.

Bradley

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Remarkable.It help me a lot. Thank you.

ingcaschera

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Pretty good and useful info for beginners.

Chapman

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It was truly informative. Your post is very useful.Many thanks for sharing!
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