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Hi all, These days our customer asks us to figure out ,during reflow,the BGA ball and solder paste,which will first melt? I think it's very hard to get the rusult.coz I think it'll vary at diffrent part of the BGA,and how can this affect the performence of solder joint? Please advise!
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ondrasebesta
2017/2/4 1:19:00
Thanks for your sharing.It helps me a lot.
Clyde
2017/2/4 1:19:00
A great sharing for beginners. Thanks for your efforts and I will follow you and keep reading your posts.
Francisco
2017/2/4 1:19:00
I have truly impressed by your post. Please keep us up to date like this.
andrewr
2017/2/4 1:19:00
Quite useful and impressive info.
Fatih YASAR
2017/2/4 1:19:00
I am going to keep checking for new writings.