High Volume BGA re-balling

2017/2/2 1:05:40

Hello all:

We looking for an effective solutions for HIGH-VOLUMN BGA RE-BALLING. (i.e. cases where we got to scrap thousands of BGA modules and re-use the chip)

BGA spec. (general) W: 8mm, L: 13mm, H: 1.12 mm, No. of ball: 60, Size: 0.45mm Pitch: 0.80 mm

The current method we've used (BGA reballing by applying ball and flux) is just ok for small volume only.

Barlow

2017/2/4 1:05:40

I was really confused, and this answered all my qutoiesns.

Yucel Calik

2017/2/4 1:05:40

Remarkable.

CurveAudioDesign

2017/2/4 1:05:40

Impressive

Beetlesmart

2017/2/4 1:05:40

You are a genuis!

efem elec. co.

2017/2/4 1:05:40

Really helpful.