Category:Electronic Components BGA

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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X-Ray Criteria for BGA Solder Ball Reply 2017-02-02 23:27:52
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Byron

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Hi,
What's the maximum and minimum solder void that can be accepted during X-ray?
What about the percentage of Ball Roundness?
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Chad

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tony165

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Micha.R

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seamster

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