Category:Electronic Components BGA

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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X-Ray Recommendations Reply 2017-02-02 23:55:39
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Carter

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Hi,
We place BGA, but until now have not used X-Ray inspection, and it would be a good thing to have. Can anyone recommend a low cost X-Ray that would get us by. We don't need something fast, but it should be able to show us clearly voids etc.
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Bill

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Your post answered my questions. Thanks a lot.

Jeronimo F Atencio

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Your article answered all my puzzles.

Alessandro Cappello

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It is very interesting and helpful.I will keep check your post.

Livio Collovini

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You are a genuis!

Chris Duca

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Impressive and helpful.
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