Category:Electronic Components BGA

Group Administrators: 1 | Group Member: 95 | Group Threads: 100

A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

Thread Reply
Phosphorus Crystal Formation Reply 2017-02-02 20:41:48
179 views
4 comments
24 likes

Tony Stamm

Leave A Message

Follow

We are having intermittent faults with BGA's soldered onto an immersion gold finish board with snpb solder. One potential cause I have been informed is the formation of phosphorus crystals. As I am not an expert in this area I have no idea if this is correct or not. Can anyone point me in the direction of any literature on this subject or offer advice on how to resolve this crystal formation.
24 likes
Statement: This post is only the personal view of the author and does not represent the opinions of ALLPCB.com.

Igor

Leave A Message

Follow

Quite useful and impressive info. I have learned a lot from your article and I will keep on reading your sharing.

Darren

Leave A Message

Follow

I have share it with my classmates. They all appreciate it a lot.

Laszlo Toth

Leave A Message

Follow

It help me a lot. Thank you.

Davide Fontana

Leave A Message

Follow

Good resource for new beginners.
ThreadReply