Category:Electronic Components BGA

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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BGA reflow on bottomside Reply 2017-02-02 20:27:03
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Eugene Shamaev

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Hi all,
I have never had to run a product with BGAs on the bottomside of a double sided board. I was just wondering if this is a done thing ? or should I stay well clear.
any replies appreciated.
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David Soares

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Great thanks for your helpful info. Really useful.

Francisco Javier

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Marvelous post. Appreciate it very much.

ramadanrenan

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Pretty good and useful info to my job. Keep on checking your post.

Indi

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You did a great job. Really appreciate your content.

Francisco Mesa

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Pretty good and useful info to my job. Keep on checking your post.
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