Category:Electronic Components BGA

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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How to calculate BGA height change? Reply 2017-02-01 14:46:47
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Alex

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Does any one know how to calculate BGA height change after reflow oven?I guess the calculation will be based on the component size, weight, ball diameter and ball count of the BGA, but how to get the actual height?
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STEFAN

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Remarkable.I have learned a lot from your post.

Garry Thorn

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I will keep on reading your sharing. Thats really interesting and helpful.

Giovanni Romanelli

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Your post answered my questions. Thanks a lot.

Michel Froehlich

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Your post answered my questions. Thanks a lot.
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