Category:Electronic Components BGA

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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BGA questions Reply 2017-02-01 13:19:32
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James Kent

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Hi,
I would like to get in contact with people that have knowledge about the BGA mounting process. Please drop me an e-mail.
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Statement: This post is only the personal view of the author and does not represent the opinions of ALLPCB.com.

Arnold

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Inictllgenee and simplicity – easy to understand how you think.

francois.jacob.hello

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An interesting post.

Holger

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It answered all my puzzles.Very helpful.

Claudio Troiano

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Interesting and useful!
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