Category:Electronic Components BGA

Group Administrators: 1 | Group Member: 95 | Group Threads: 100

A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

Thread Reply
BGA Reply 2017-02-01 08:33:22
86 views
3 comments
12 likes

Antonio Semeraro

Leave A Message

Follow

Hi:
Can you give me some tips for choose a BGA rework system? Where can I buy this machines?
Thanks for your help!
12 likes
Statement: This post is only the personal view of the author and does not represent the opinions of ALLPCB.com.

Hector Jose

Leave A Message

Follow

Remarkable.

Eric Flores Solis

Leave A Message

Follow

Your article answered all my puzzles.

Khairul Mustaqim

Leave A Message

Follow

Interesting and useful!
ThreadReply