Quote by Sales
Cart 0
Thank you very much for your valuable suggestion!
We will solve it as soon as possible!

Shengmiao Technology Manufacturing Ratings

Shengmiao Technology

MPN:S160702

Praise Rate

100%

Delivery Rate

100%

Complaint Rate

0%

Return Rate

0%

Shengmiao Technology's Basic Information Certification

Business Scope: High volume
Best For: 1-2layer
Establish Time: 2013
Factory Area: 4000㎡ (Rent)
Monthly Capacity: 15000㎡
Company Type: Domestic Sole InvestmentEnterprise
Total Staff: 350
QA: 30
MD: 245
Design Engineer: 20
Production Engineer: 22
Management: 33
Certification Type:

Samples Manufactured By Shengmiao Technology

  • 4 Layers Immersion Gold PCB

    4 Layers Immersion Gold PCB

  • 4 Layers Immersion Gold Video card Board

    4 Layers Immersion Gold Video card Board

  • 6 Layers BGA PCB

    6 Layers BGA PCB

  • 8 Layers HDI PCB

    8 Layers HDI PCB

  • BGA板8 Layers Blind Vias BGA PCB

    BGA板8 Layers Blind Vias BGA PCB

  • 8 Layers Communication PCB

    8 Layers Communication PCB

  • 15W Aluminum Substrate PCB

    15W Aluminum Substrate PCB

  • 18 Layers Communication PCB

    18 Layers Communication PCB

  • 5050 Aluminum Substrate PCB

    5050 Aluminum Substrate PCB

  • 94VO Single Sided Board

    94VO Single Sided Board

  • Single Sided Board

    Single Sided Board

  • Single Sided Aluminum Substrate PCB

    Single Sided Aluminum Substrate PCB

  • 2Single Sided Aluminum Substrate PCB Two

    2Single Sided Aluminum Substrate PCB Two

  • Electronic Dictionary PCB

    Electronic Dictionary PCB

  • Multi-layer PCB

    Multi-layer PCB

  • Hexagon Aluminum Substrate PCB

    Hexagon Aluminum Substrate PCB

  • Aluminum Substrate

    Aluminum Substrate

  • Aluminum Substrate One

    Aluminum Substrate One

  • Aluminum Substrate Two

    Aluminum Substrate Two

  • Digital Camera PCB

    Digital Camera PCB

  • Double Sided White Solder Mask

    Double Sided White Solder Mask

  • Double Sided PCB

    Double Sided PCB

  • Double Sided Power Board

    Double Sided Power Board

  • Layers Blue Solder Mask

    Layers Blue Solder Mask

  • Layers Blue Solder Mask Board

    Layers Blue Solder Mask Board

  • Layers Hexagon Two

    Layers Hexagon Two

  • HASL 4 Layers

    HASL 4 Layers

  •  4 Layers PCB

    4 Layers PCB

Shengmiao Technology's Production Facilities

  • AOI Scanning Machine

    AOI Scanning Machine

  • Horizontal Comprehensive Line

    Horizontal Comprehensive Line

  • Circuit Developing Machine

    Circuit Developing Machine

  • OSP Automation Line

    OSP Automation Line

  • Flying Probe Tester

    Flying Probe Tester

  • Electricity Testing Machine

    Electricity Testing Machine

  • Automatic Washing Board Line

    Automatic Washing Board Line

  • Automatic Plating Line

    Automatic Plating Line

  • Automatic Immersion Copper Line

    Automatic Immersion Copper Line

  • Multi-layer Laminate Device

    Multi-layer Laminate Device

  • Automatic Exposure Machine

    Automatic Exposure Machine

  • Brown Oxide Line

    Brown Oxide Line

  • Laser Drilling Machine

    Laser Drilling Machine

  • Mechanical Drilling Machine

    Mechanical Drilling Machine

  • Automatic Etching Line

    Automatic Etching Line

  • Automatic Target Shooting Machine

    Automatic Target Shooting Machine

  • Lamination Transmission Line

    Lamination Transmission Line

  • Drilling Room

    Drilling Room

Shengmiao Technology's Manufacturing Capabilities

Brithish Imperial System Metric System
1 Max Size of Panel 22" x 26" 550 x 650mm
2 Hole Size
Min Hole Size 0.008" 0.20mm
Finished Hole Tolerance PTH ±0.003" ±0.075mm
NPTH ±0.002" ±0.050mm
Lamination ±0.002" ±0.050mm
Aspect Ratio 9:01 9:01
3 Laser Drilling Hole(HDI)
Micro Hole Diameter 0.004" - 0.010" 0.10 - 0.15mm
Aspect Ratio 1:01 1:01
4 Min Track/Spacing ?oz / 18μm 0.004" / 0.004" 0.1/ 0.1mm
1oz / 35μm 0.006" / 0.006" 0.15 / 0.15mm
2oz / 70μm 0.008" / 0.008" 0.20 / 0.20mm
3oz / 105μm 0.010" / 0.010" 0.25 / 0.25mm
5 Others
Solder Mask ±0.003" ±0.075mm
Layer Spacing ±0.0024" ±0.060mm
Hole Spacing(Outer) ±0.003" ±0.075mm
Min Hole Spacing (Inner) 2L - 8L 0.010" 0.25mm
10L - 22L 0.012" 0.30mm
6 Outlayer
Plate Edge to Plate Edge ±0.004" ±0.100mm
Hole to Plate Edge ±0.004" ±0.100mm
Min Copper Trace to Plate Edge Outlayer 0.010" 0.25mm
Inner Layer 0.016" 0.40mm
7 Max Finished Copper 4oz 140μm
8 Max Thickness 0.189" 4.80 mm
9 Min Thickness Double-Sided 0.008" 0.20mm
4 Layers 0.016" 0.40mm
6 Layers 0.020" 0.60mm
10 Min Via Wall 0.004" 0.10mm
11 Min Solder Mask Thickness 0.004" 0.10mm
12 Impedance Control(Ω) ±10% ±10%
13 Number of Layers 1-22 Layers
14 Surface Finish HASL with lead, HASL lead free, Immersion gold, Immersion sliver,OSP,Gold finger

Feedback

The comments are from customers' first-hand purchasing experience!

Low Cost : 5
High Quality : 5
On-time : 5

5/5.0

Overall Rating