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Multilayer Manufacturing Ratings

Multilayer

MPN:M160801

Praise Rate

100%

Delivery Rate

100%

Complaint Rate

0%

Return Rate

0%

Audited By

Name: LiangChuan(Factory Auditor)

Duty: ALLPCB inspects the manufacturers for you by the on-the-spot investigation of the fabrication capacity, quality control, facilities, etc. ALLPCB factory auditor verifies the following information with the criteria of impartiality.

Multilayer's Basic Information Certification

on-the-spot investigation
Business Scope: Prototype
Best For: All kinds of high standard PCB manufacture
Establish Time: 2005
Factory Area: 3700㎡
Monthly Capacity: 50000㎡
Company Type: Domestic Sole InvestmentEnterprise
Total Staff: 490
QA: 80
MD: 200
Design Engineer: 100
Production Engineer: 10
Management: 20
Certification Type:

Multilayer Manufacturer Quality Control

on-the-spot investigation
Picture Certification Name Certified By Certificate No. Business Scope Availiable Date --- Expired Date

GB4943.1-2011

CHINA QUALITY CERTIFICATION CENTRE

CQC14001107055

PCB

2014-04-03---

IS0 9001:2008

SGS United Kingdom Ltd Systems & Services Certification

HK07/01123

Manufacture of Single and double sided and multilayer printed circuit boards

2016-2-28---2018-9-15

ISO/TS 14001:2004

SGS United Kingdom Ltd Systems & Services Certification

CN08/32249

Manufacture of Single and double sided and multilayer printed circuit boards

2014-12-26---2017-12-25

UL

UL

ZPMV2.E307592

Wiring, Printed-Component

2015-04-23

Multilayer's Manufacturer Audit

on-the-spot investigation

All these photos were taken by the manufacturer auditor to ensure the reliability.

Sample Display Area

Sample Display Area

QC Department

QC Department

Plating Line

Plating Line

Wet Area

Wet Area

Material Warehouse

Material Warehouse

Ink Jet Printer

Ink Jet Printer

Silkscreen

Silkscreen

Soldermask Developing Machine

Soldermask Developing Machine

Soldermask Exposure

Soldermask Exposure

SoldermaskSilkscreen

SoldermaskSilkscreen

Soldermask Brushing Machine

Soldermask Brushing Machine

Outlayer Etching Machine

Outlayer Etching Machine

Circuit Developing Machine

Circuit Developing Machine

Circuit Laminator

Circuit Laminator

Drilling

Drilling

Physics Laboratory

Physics Laboratory

Inner Circuit Etching Machine

Inner Circuit Etching Machine

Circuit Brushing Machine

Circuit Brushing Machine

Deburring Machine

Deburring Machine

Dry Area

Dry Area

Baking Room

Baking Room

Film Test

Film Test

Flying Probe Test

Flying Probe Test

Factory Environment

Factory Environment

Brown Oxide Line

Brown Oxide Line

Finished Products Cleaning

Finished Products Cleaning

FQC Test

FQC Test

Molding

Molding

AOI Test

AOI Test

Semi-finished Products Inspection

Semi-finished Products Inspection

Base Material Warehouse

Base Material Warehouse

Multilayer's Materials Certification

on-the-spot investigation
Name Brand / Model Producer Market Price
Inner Process Wet Film
Silkscreen Ink Brand TAIYO
Soldermask Ink Brand TAIYO-PSR-2000
Plating Line Potion Brand ROHMHAAS
Outlayer Dry Film Brand AsahiKASEI
Base Material&Model ITEQ
SHENGYI
audit

Multilayer's Manufacturing Equipment Certification

on-the-spot investigation
Item Brand / Model Producer Quantity Market Price
Automatic V-CUT Machine XINHE
Brown Oxide Line YUZHOU
CNC Routing Machine BIAOFUTE
Ink Jet Printer Wingate System
Developing Machine YUZHOU
Scrubbing Machine YUZHOU
Laser Plotter Orbotech
Exposure Machine WEICHUANGXIN
Etching Machine HONGLING
DES Line YUZHOU
Gold Plating Line Automatic Plating Line
PTH Line Automatic PTH Line
Laminating Machine HUOQUAN
Imaging Machine WEICHUANGXIN
Film Machine YAN TIN CHEMICALS
Drilling Machine DALIANGWANXIANG
audit

Multilayer's Testing Equipment Certification

on-the-spot investigation
Item Brand / Model Producer Quantity Market Price
X-RAY Machine ZHENGYE
AOI Orbotech
Testing Machine Hi-Light
audit

Multilayer's Manufacturing Capabilities

on-the-spot investigation
Item Capability Details
Profile V-CUT Angle 30°, 45°, 60°
Max. V-CUT Number 20
Profile Width 60mm
Remian Thickness 0.25mm<Remian Thickness<0.40mm
V-CUT Symetry Tolerance ±0.10mm≤Tolerance<±0.15mm
Max.V-CUT Line Min.Spacing of Two V-CUT Line:1.0mm,Quantity is customized
Gold Finger Chamfer Angle 20°, 30°, 45°, 60°
Gold Finger Chamfer Angle Tolerance ±5°
Min. Gold Finger TAB Safe Spacing 0.4mm
Min.Gold Finger Edge to Profile Spacing 0.5mm
Profile Precision(Side to Side) ±0.1mm
Trace/Spacing Inner Layer Min. Trace/Spacing 18um Copper ≥3/4 mil; 35um Copper ≥4/5 mil; 75um Copper ≥5/7 mil; 105um Copper ≥6/10 mil
Outlayer Min. Trace/Spacing 18um Copper ≥3/4 mil or Partial 3/3mil; 35um Copper ≥4/5 mil; 75um Copper ≥5/7 mil;105um Copper ≥6/10 mil
Trace Tolerance ≤5.0 mil ±1.0mil
Drill Hole Size ≥6.0mm CNC Milling
Hole Size :0.15mm Max. Board Thickness: 1.2 mm
Hole Size : 0.2 mm Max. Board Thickness: 2 mm
Hole Size: 0.25mm≤Ф≤0.35mm Max. Board Thickness: 3.2 mm
Hole Size: 0.4mm≤Ф≤0.55mm Max. Board Thickness: 4.8 mm
Hole Size >0.55mm Max. Board Thickness: 6.4 mm
PTH Hole Tolerance ±0.05≤Tolerance<±0.1mm
NPTH Hole Tolerance ±0.05≤Tolerance<±0.075mm
Hole to Hole Spacing 8≤Spacing≤10
Test Standard Finished Inspection and Performance Criteria IPC-A-600H/ Ⅱ/ Ⅲ
Test Ionic Contamination 1.56μg NaCl.Eq/cm2
Warp Capacity 0.7%≤ Warp ≤0.5%
Resistance Tolerance ±10%
Test Equipment TektronixDSA8200
Test Standard ±10%
Test Frequency Range 0-20GHZ
Available Report Thermal Stress Test Thermal Stress Test Report
Impedance Control Test Impedance Control Test Report
Withstanding Voltage Test Withstanding Voltage Test Report
Solderability Test Solderability Test Report
Microsection Analysis Microsection Analysis Report
RoHS Test RoHS Test Report
Insulation Resistance Test Insulation Resistance Test Report
Peel Strength Test Peel Strength Test Report
Surface Finish(Coating)Thickness HASL/HASL lead free 40-1000u"
OSP 8-20u"
ENIG Ni 90-236u",Au 1-3u", Thick Au 5-8u"
Immersion Sliver 5-15u"
Immersion Tin 30-50u"
Hard Gold Plating 5-30u"
Soft Gold Plating 1-3u"
ENEPIG Ni 90-236u",Pd 1-8u",Au 1-3u"
Plating Copper Nickel Gold Ni:100-400u",Au:1-3u"
Gold Finger Ni:100-400u",Au:15-30u"
Carbon Ink ≥12um
Green Ink Circuit Corner≥5um,Circuit Surface≥10um
Surface Finish Type(Lead Free) HASL Lead Free,ENIG,ENEPIG,Immersion Sliver,Immersion Tin,Hard Gold Plating,Soft Gold Plating,OSP
Type(Lead) HASL
Aspect Ratio 10:1
Max.Dimension 500mm*900mm
Min.Dimension 30mm*50mm
Board Thickmess 0.4mm-6.5mm
Max.Gold Finger Height 3mm
Min.Gold Finger Spacing 0.1mm
Min.Subsectional Gold Finger Spacing 0.15mm
Soldermask&Silksreen Soldermask Green,Sub-green,Black,Matt Black,Blue,Yellow,Red,White
Silksreen White,Black
Green Ink Bridge 3-4 mil
Green Ink Exposure Min.:2mil Normal: 4mil
Resin Plugged Hole Size Range 0.2-0.6mm
Resin Plugged Hole Max.Aspect Ratio 1:1
Silksreen Width 5 mil
Pad Copper Thickness 35um ≥8mil
Min.BGA Pad Diameter 10 mil
Pad Tolerance(BGA) ±20%
SMT Width 8mil
Aspect Ratio 10:1
Normal Board Layer 26 Layers
Board Thickness 0.4mm—6.0mm
Board Tolerance(Normal) T≤1.0 ±0.10 ; 1.0<T≤1.6±0.13 ; 1.6<T≤2.5±0.18; 2.5<T≤3.2 ; T≥3.2 ±8%
Board Tolerance(Special) Board Thickness>3.0 mm Tolerance:±8%
Max.Dimension 550×650mm
Min.Dimension 20mm*30mm
Max.Copper Thickness 5oz
Board Material Normal Tg FR4 S1141
Normal Tg FR4(Halogen-free) S1150G
Hybrid Rogers4350+FR-4
CEM-3 Single-sided, Double-sided
Prepreg: Normal(106、1080、3313、2116、7628,1080TG170、2116TG170、1080S1000-B、2116S1000-B)、RCC、IT158/LT180A Rogers4450F、Arlon49N、Arlon38N(106)、Arlon99ML(1080)、ST115B(106)
First-step HDI Only First-step is Available.
Design Design Software GenesisUcam
Gerber File Format ger274X
Drill File Format excellon2
audit

Feedback

The comments are from customers' first-hand purchasing experience!

Low Cost : 5
High Quality : 5
On-time : 5

5/5.0

Overall Rating