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Hua Feng Circuit Manufacturing Ratings

Hua Feng Circuit

MPN:H160701

Praise Rate

100%

Delivery Rate

87.88%

Complaint Rate

0%

Return Rate

0%

Audited By

Name: LiangChuan(Factory Auditor)

Duty: ALLPCB inspects the manufacturers for you by the on-the-spot investigation of the fabrication capacity, quality control, facilities, etc. ALLPCB factory auditor verifies the following information with the criteria of impartiality.

Hua Feng Circuit's Basic Information Certification

on-the-spot investigation
Business Scope: Prototype,Low volume
Best For: 1-8 layer low volume PCB manufacture and prototype
Establish Time: 1987
Factory Area: 7000㎡ (Purchase)
Monthly Capacity: 18000㎡
Company Type: Group Corporation
Total Staff: 400
QA: 22
MD: 269
Design Engineer: 34
Production Engineer: 8
Management: 10
Certification Type:

Hua Feng Circuit Manufacturer Quality Control

on-the-spot investigation
Picture Certification Name Certified By Certificate No. Business Scope Availiable Date --- Expired Date
ISO 9001:2008 SGS   Manufacture of printed circuit board 2014-10-21——2017-10-20
ISO14001:2004 SSCC 061-14-E1-0042-R2-M Single-sided, double-sided and multi-layer printed circuit board manufacturing and related management activities 2014-06-17——2017-06-16
ISO/TS16949:2009 IATF   Manufacture of printed circuit boards used for automobile 2014-10-21——2017-10-20
UL   ZPMV8.E187447 Wiring, Printed Certified for Canada- Component  

Samples Manufactured By Hua Feng Circuit

Hua Feng Circuit's Manufacturer Audit

on-the-spot investigation

All these photos were taken by the manufacturer auditor to ensure the reliability.

Brown Oxide Line

Brown Oxide Line

Sewerage System

Sewerage System

X-RAY Machine

X-RAY Machine

Finished Products Inspection

Finished Products Inspection

Immersion Gold Line

Immersion Gold Line

Packing

Packing

Material Warehouse

Material Warehouse

Soldermask Exposure

Soldermask Exposure

Drilling

Drilling

Inner Layer Exposure Machine

Inner Layer Exposure Machine

Finished Products Cleaning

Finished Products Cleaning

Pre-treatment

Pre-treatment

Engineering

Engineering

Film Test

Film Test

Etching Tin Stripping Line

Etching Tin Stripping Line

Plating Line

Plating Line

Finished Products

Finished Products

Flying Probe Test

Flying Probe Test

Molding

Molding

Silkscreen

Silkscreen

AOI Test

AOI Test

Outlayer Etching Machine

Outlayer Etching Machine

Semi-finished Products Inspection

Semi-finished Products Inspection

Circuit Developing Machine

Circuit Developing Machine

Circuit Exposure Machine

Circuit Exposure Machine

Circuit Brushing Machine

Circuit Brushing Machine

Laminating Machine

Laminating Machine

Inner Layer Brushing Machine

Inner Layer Brushing Machine

Base Material Warehouse

Base Material Warehouse

Potion Area

Potion Area

Physics Laboratory

Physics Laboratory

Chemistry Laboratory

Chemistry Laboratory

Factory Environment

Factory Environment

Hua Feng Circuit's Materials Certification

on-the-spot investigation
Name Brand / Model Producer Market Price
Inner Process Dry Film
Silkscreen Ink Brand RUTAI
Soldermask Ink Brand TAIYO 4000
Plating Line Potion Brand ROHMHAAS
Outlayer Dry Film Brand HITACHI
Du Pont
Base Material&Model ITEQ
NANYA
SHENGYI
audit

Hua Feng Circuit's Manufacturing Equipment Certification

on-the-spot investigation
Item Brand / Model Producer Quantity Market Price
Automatic V-CUT Machine Enter
Brown Oxide Line YUZHOU
CNC Routing Machine JIETONG
Immersion Gold Line Automatic Immersion Gold Line
Developing Machine YUZHOU
Scrubbing Machine YUZHOU
Laser Plotter Hi-Light
Exposure Machine C SUN
Etching Machine YUZHOU
DES Line YUZHOU
Gold Plating Line Automatic Plating Line
PTH Line Automatic PTH Line
Laminating Machine HENGDA
Imaging Machine C SUN
Film Machine ZHISHENG
Drilling Machine HAN’S
audit

Hua Feng Circuit's Testing Equipment Certification

on-the-spot investigation
Item Brand / Model Producer Quantity Market Price
X-RAY Machine ZHENGYE
AOI Orbotech
Testing Machine Hi-light/ JOINT POWER
audit

Hua Feng Circuit's Manufacturing Capabilities

on-the-spot investigation
Item Capability Details
Available Report Thermal Stress Test Thermal Stress Test Report
Impedance Control Test Impedance Control Test Report
Withstanding Voltage Test Withstanding Voltage Test Report
Solderability Test Solderability Test Report
X-Ray Test X-Ray Test Report
Microsection Analysis Microsection Analysis Report
Peel Strength Test Peel Strength Test Report Report
Profile V-CUT Centre Line to Pattem Spacing Board Thickness 0.4-1.0mm,12mil; Board Thickness 1.1-1.6mm,14mil; Board Thickness 1.7-2.5mm,16mil; Board Thickness 2.6-3.2mm,19mil
V-CUT Symetry Tolerance ±0.1mm
Max.V-CUT Line Min.Spacing of Two V-CUT Line:1.0mm,Quantity is customized
V-CUT Angle Tolerance ±5°
V-CUT Angle Specification 20°, 30°,45°
Gold Finger Chamfer Angle 20-60°
Gold Finger Chamfer Angle Tolerance ±5°
Min. Gold Finger TAB Safe Spacing 0.5mm
Min.Gold Finger Edge to Profile Spacing 0.5mm
Depth Control Milling Slot(Side) Depth Precision(NPTH) ±0.125mm
Profile Precision(Side to Side) ±0.1mm
Max.Milling Slot Tolerance(PTH) ±0.125mm
Max.Milling Slot Tolerance(NPTH) ±0.10 mm
Min.Milling Slot Tolerance(PTH) ±0.10 mm
Min.Milling Slot Tolerance(NPTH) ±0.05 mm
Trace/Spacing Inner Layer 0.5oz Copper:3.5/3.5,1oz Copper:4/4,2oz Copper:6/6,3oz Copper:9/8,4oz Copper 10/10
Outlayer 1/3oz Copper:3.5/3.5,0.5oz Copper:4/4,1oz Copper:5/5.5,2oz Copper:7/8,3oz Copper:8/10,4oz Copper:9/13
Trace Tolerance >5.0 mil ±20%; ≤5.0 mil ±1.0mil
Test Standard Finished Inspection and Performance Criteria IPC-A-600H IPC-A-610E GB4588
Test Method IPC-TM-650
Test Ionic Contamination 1.56μg NaCl.Eq/cm2
Warp Capacity Symmetric Structure≤0.75%
Resistance Tolerance ±10%
Test Equipment POLAR CITS900s4
Test Frequency Range 0-20GHZ
Surface Finish(Coating)Thickness HASL/HASL lead free 1-40um
OSP 0.15-0.35 um
ENIG Ni 3-5 um,Au 0.025-0.075 um
Immersion Sliver 0.12-0.4 um
Immersion Tin 0.8-1.2 um
Hard Gold Plating 0.76 um
ENEPIG Ni 3-5um,Pd 0.05um,Au 0.025-0.076um
Plating Cu/Ni/Au 0.05-0.3 um
Gold Finger NI:3-5 um AU:0.76 um
Carbon Ink 10-20 um
Green Ink Circuit Corner≥5um, Circuit Surface≥10um
Peelable Soldermask 0.2-1.0 mm
Soldermask&Silksreen Max.Solermask Plugged Hole Diameter 0.55mm
Soldermask Green,Sub-green,Black,Matt Black,Blue,Yellow,Red,White
Silksreen White,Black,Yellow
Max.Peelable Blue Mask Plugged Hole Diameter 0.4mm≤NPTH Hole Size≤4mm
Resin Plugged Hole Size Range 0.2-0.6mm
Resin Plugged Hole Max.Aspect Ratio 1:1
Min.Silkscreen to Solder Brige Spacing Silksreen Width≥8mil; Finished Copper ≤1.5OZ ≥4mil; Finished Copper 2OZ ≥5mil; Finished Copper 3OZ ≥6mil; Finished Copper 4OZ ≥7mil
Pad Min.Inner and Outlayer Pad Size of Mechanical Hole 0.1 mm
Min.BGA Pad Diameter 0.25mm
Pad Tolerance(BGA) ±20%
Aspect Ratio 10:1
Drill Min Board Thickness of 0.1/0.15/0.2mm Mechanical Drill 2.0mm for 0.2 drill ( No 0.1 and 0.15 Drill Bit)
Mechanical Hole Diameter Min:0.2mm, Max:6.5mm, >6.5mm:Milling
Max.Through-hole Board Aspect Ratio 10:1
Max.Mechanical Blind Hole Depth Aspect Ratio 0.6:1
Min. Mechanical Drill Hole Depth 0.1mm
Min.Mechanical Drill to Conductor Spacing(Non Blind Hole Board and First-step Laser Blind Hole ) 0.175mm for 4layer and 0.2 for 6layer and above
Min.Mechanical Drill to Conductor Spacing(Mechanical Blind Hole Board and Second-step Laser Blind Hole) 0.2mm for machanial blind or buried (NA for laser drill)
Min. Different Circuit Hole Wall Spacing 0.30mm
Min. Same Circuit Hole Wall Spacing 0.15mm
Min.NPTH Hole Wall Spacing 0.25mm
Hole Position Tolerance 0.075mm
Min.NPTH Hole Size Tolerance 0.05mm
Solderless Component Hole Diameter Tolerance ±0.05mm
Tapered Hole Depth Tolerance ±0.125mm
Tapered Hole Diameter Tolerance ±0.25mm
Normal Board Board Tolerance(Normal) Board Thickness≤1.0 mm, Tolerance:±0.1mm; Board Thickness>1.0 mm, Tolerance:±10%
Board Tolerance(Special) Board Thickness>3.0 mm , Tolerance:±8%
Max.Dimension 490*590mm
Min.Dimension 40mm*40mm
Metal Base Board Layer 1-20 Layers
Board Thickness 0.3-3.2 mm
Copper Thickness 1-5 oz
Metal Base Thickness 1.5mm
Metal Base Material Aluminum
Min. Hole Size and Tolerance 0.2mm
Profile Precision ±0.1mm
Partial PCB Surface Finish OSP,ENIG,Immersion AG,Immersion Tin,HASL(LF),Hard Gold,Carbon
Metal Surface Finish Copper Base: Gold Plating;Aluminum Base: No Treatment
Thermal Conductive Adhesive Thickness(Dielectrics) 3mil
Lamination Multi-laminated Blind Hole Board Two-time Mechanical Blind Hole
Product Type Rigid 5oz(cu thickness 5oz and less), Stepped Slot, Countersunk hole, Half Hole, via in Pad Hole, Blind and Buried of Mechanical Drill, Aluminum Single Layer
Board Material Normal Tg FR4 NY1140/S1141
Normal Tg FR4(Halogen-free) S1150G
High Tg FR4(Halogen-free) S1165
High CTI S1600
High Tg fr4 S1000-2M/IT180A
Ceramic Powder Filled High Frequency Material Rogers4350
Surface Finish Type(Lead Free) HASL Lead Free,ENIG,ENEPIG,Immersion Sliver,Immersion Tin,Hard Gold Plating, OSP
Type(Lead) HASL
Aspect Ratio 10:1
Max.Dimension 490mm*590mm
Min.Dimension 40mm*50mm
Board Thickmess 0.4mm-3.2mm
Max.Gold Finger Height 3 mm
Min.Gold Finger Spacing 0.1 mm
Min.Subsectional Gold Finger Spacing 0.15mm
Design Design Software Genesis
Gerber File Format ger274X/274-D
Drill File Format excellon2
audit

Manufacturer Financial Statements

Financial ReportManufacturing Capacity

Development History

No Data

Latest Manufacturing Orders

  • Order No.LayersNumberBuyer’s CountryTransaction ValueTransaction Date
  • H22291G3SG35 8 Layers 20 PCS THAILANDbo***ja USD $556.42 2017/6/8 15:25:40
  • H19550G2SG29 4 Layers 25 PCS AUSTRALIAvz***00 USD $309.48 2017/6/2 14:52:18
  • H19677ASG32 4 Layers 200 PCS RUSSIAN FEDERATION, THEal***27 USD $352.98 2017/5/29 18:40:40
  • H21167ASK110 8 Layers 10 PCS UNITED STATES OF AMERICAzh***li USD $1078.06 2017/5/25 0:54:41
  • H22917ASG34 4 Layers 20 PCS GERMANYja***tl USD $460.78 2017/5/22 16:22:19
  • H20130ASG232 8 Layers 25 PCS CZECH REPUBLIC, THEno***ny USD $904.18 2017/5/16 19:28:29
  • H22614ASG22 4 Layers 10 PCS SOUTH AFRICAjoed USD $408.62 2017/4/27 21:18:17
  • H22614ASG21 4 Layers 10 PCS SOUTH AFRICAjoed USD $399.92 2017/4/27 21:16:58
  • H20762ASG23 6 Layers 50 PCS SWEDENde***on USD $382.54 2017/4/26 1:22:23
  • H18965G3SG312 6 Layers 10 PCS UNITED STATES OF AMERICAsm***es USD $563.37 2017/3/15 14:21:19
  • H18965G3SG311 6 Layers 10 PCS UNITED STATES OF AMERICAsm***es USD $660.74 2017/3/15 14:19:41
  • H18965G3SG310 2 Layers 20 PCS UNITED STATES OF AMERICAsm***es USD $434.7 2017/3/15 14:17:28
  • H21234K2SK212 4 Layers 5 PCS INDIApa***ni USD $243.43 2017/3/6 21:21:52
  • H17907AXG140 4 Layers 150 PCS UKRAINEni***ot USD $1204 2017/2/23 15:39:57
  • H20368K2SK22 4 Layers 5 PCS EGYPTsluu USD $397 2017/2/22 11:22:39
  • H18555ASG25 8 Layers 10 PCS al***cb USD $405.72 2017/2/10 15:33:20
  • H19251ASG420 2 Layers 25 PCS ITALYan***ni USD $188 2017/2/9 16:19:16
  • H19251ASG418 2 Layers 15 PCS an***ni USD $149 2017/2/9 16:15:07
  • H17907ASG134 4 Layers 15 PCS ni***ot USD $440 2017/2/9 1:41:23
  • H21181G3SG33 4 Layers 10 PCS UNITED STATES OF AMERICAdr***y5 USD $284 2017/2/8 17:40:47

Feedback

The comments are from customers' first-hand purchasing experience!

Low Cost : 5
High Quality : 5
On-time : 5

5/5.0

Overall Rating