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HONGYUNTONG Manufacturing Ratings

HONGYUNTONG

MPN:H160702

Praise Rate

100%

Delivery Rate

100%

Complaint Rate

0%

Return Rate

0%

HONGYUNTONG's Basic Information Certification

Business Scope: Prototype,Low volume
Best For: Quick Turn PCB Prototype and Low Volume PCB Manufacture
Establish Time: 2002
Factory Area: 5000㎡
Monthly Capacity: 5000㎡
Company Type: Domestic Sole InvestmentEnterprise
Certification Type:

HONGYUNTONG Manufacturer Quality Control

Picture Certification Name Certified By Certificate No. Business Scope Availiable Date --- Expired Date
ISO9001:2008/GB/T 19001-2008 181526-2015-AQ-RGC-R&A 1-layer, 2-layer, Multi-layer PCB Manufacturing 2015-9-01--2018-9-01
ISO/TS16949:2009 159458-2014-AQ-RGC-IAIF 1-layer, 2-layer, Multi-layer PCB Manufacturing 2014-9-03--2017-9-02
ISO14001:2004 90053-2009-AQ-RGC-R&A 1-layer, 2-layer, Multi-layer PCB Manufacturing 2015-3-25--2018-3-25

Samples Manufactured By HONGYUNTONG

  • 12 layers of characteristic impedance of multilayer printed circuit board

    12 layers of characteristic impedance of multilayer printed circuit board

  • BGA golden finger multilayer printed circuit board

    BGA golden finger multilayer printed circuit board

  • thin coil type printed circuit board

    thin coil type printed circuit board

  • high TG blind and buried vias multilayer printed circuit board

    high TG blind and buried vias multilayer printed circuit board

  • high aspect ratio gold multilayer printed circuit board

    high aspect ratio gold multilayer printed circuit board

  • high precision step multilayer printed circuit board

    high precision step multilayer printed circuit board

  • hick copper multilayer printed circuit board hole buried coil

    hick copper multilayer printed circuit board hole buried coil

  • esin Jack characteristic impedance of multilayer printed circuit board

    esin Jack characteristic impedance of multilayer printed circuit board

  • special materials for printed circuit board

    special materials for printed circuit board

  • special printed circuit board

    special printed circuit board

  • Thin Outlayer Dented Inlayer BlindBuried Hole Multi-layer Circuit Board

    Thin Outlayer Dented Inlayer BlindBuried Hole Multi-layer Circuit Board

HONGYUNTONG's Production Facilities

  • X-ray machine(X-RAY)

    X-ray machine(X-RAY)

  • Surface copper thickness measuring instrument

    Surface copper thickness measuring instrument

  • Desmear conductive film line

    Desmear conductive film line

  • Two dimensional image measuring instrumen

    Two dimensional image measuring instrumen

  • Chemical analysis

    Chemical analysis

  • Pretreatment line emery

    Pretreatment line emery

  • Cross section analysis

    Cross section analysis

  • Hole copper thickness measuring instrument

    Hole copper thickness measuring instrument

  • Exposure machine

    Exposure machine

  • CNC milling machine

    CNC milling machine

  • CNC drilling machine

    CNC drilling machine

  • Pattem plating line

    Pattem plating line

  • Mobile probe(fly)testing machine

    Mobile probe(fly)testing machine

  • Special testing machine

    Special testing machine

  • UV visible spectrophotometer

    UV visible spectrophotometer

  • Brown line

    Brown line

HONGYUNTONG's Manufacturing Capabilities

Item Manufacture Capability
Conventional Unconventional
Acceptable Gerber File Format RS-274-X/RS-274-D Gerber File
Protel Series、PAD2000、PowerPCB、ORCAD Design File
Gerber date RS-274-X or RS-274-D with aperture list and drill files
Design file with Protel、 PAD2000、PowerPCB、ORCAD
Material FR-4、High Tg FR-4、Halogen Free Board、Metal Base Board、High Frequency Board(Rogers、Arlon、Taconic、Nelco、Taixing、Wangling)、Polyimide(PI)
Surface Finish HASL、HASL lead free、Immersion Gold、ENIG、OSP、Gold Finger
Special Board Blind/Buried Hole Board、Impedance Board、High Frequency+FR-4 Hybird Board、Aluminum Board
Max Layers 16 20
Board Thickness Min 0.5mm 0.2mm
Max 3.5mm 6.5mm
Tolerance Thickness≤1.0mm:±0.1mm;Thickness>1.0mm:±10%
Copper Thickness Outlayer 70um 210um
Inlayer 18um35um70um 105um
Min Hole Size 0.30mm 0.20mm
Min Aspect Ratio 8:1 10:1
Min Track/Spacing 5mil 4mil
Min Ring Width Component Hole 5mil 4mil
Via Hole 4mil 3mil
Min Solder Bridging 5mil 4mil
Max Dimension 450×500mm 500×1000mm
Profile Tolerance ±0.15mm ±0.10mm
Impedance Control Range Resistance≤50Ω:±5Ω;Resistance>50Ω:±10%

Manufacturer Financial Statements

Financial ReportManufacturing Capacity

Development History

No Data

Feedback

The comments are from customers' first-hand purchasing experience!

Low Cost : 5
High Quality : 5
On-time : 5

5/5.0

Overall Rating