PCB Instant Quote
Click to Get Quote by Sales Representative
Thank you very much for your valuable suggestion!
We will solve it as soon as possible!

HMX PCB Manufacturing Ratings

HMX PCB

MPN:H20160801

Praise Rate

100%

Delivery Rate

100%

Complaint Rate

0%

Return Rate

0%

Audited By

Name: LiangChuan(Factory Auditor)

Duty: ALLPCB inspects the manufacturers for you by the on-the-spot investigation of the fabrication capacity, quality control, facilities, etc. ALLPCB factory auditor verifies the following information with the criteria of impartiality.

HMX PCB's Basic Information Certification

on-the-spot investigation
Business Scope: Low volume
Best For: 1-8 layer PCB prototype
Establish Time: 2010
Factory Area: 3500㎡
Monthly Capacity: 50000㎡
Company Type: Domestic Sole InvestmentEnterprise
Total Staff: 150
QA: 12
MD: 122
Design Engineer: 8
Production Engineer: 0
Management: 8
Certification Type:

HMX PCB Manufacturer Quality Control

on-the-spot investigation
Picture Certification Name Certified By Certificate No. Business Scope Availiable Date --- Expired Date

GB/ISO 9001-2008/ISO9001:2008

IAF, CNAS

04916Q11170R0M

Processing and sales of circuit board

26th July, 2016 --- 25th July, 2019

UL

 

ZPMV2.E351431

Wiring, Printed-Component

 

UL

 

ZPMV8.E351431

Wiring Printed Certified for Canada-Component

 

HMX PCB's Manufacturer Audit

on-the-spot investigation

All these photos were taken by the manufacturer auditor to ensure the reliability.

Brown Oxide Line

Brown Oxide Line

Finished Products Inspection

Finished Products Inspection

Lamination Targeting Machine

Lamination Targeting Machine

Baking Room

Baking Room

Material Warehouse

Material Warehouse

Plating Line

Plating Line

Flying Probe Test

Flying Probe Test

Molding

Molding

Silkscreen

Silkscreen

Soldermask Exposure

Soldermask Exposure

SoldermaskSilkscreen

SoldermaskSilkscreen

Soldermask Brushing Machine

Soldermask Brushing Machine

Semi-finished Products Inspection

Semi-finished Products Inspection

Circuit Exposure Machine

Circuit Exposure Machine

Drilling

Drilling

Laminating Machine

Laminating Machine

Factory Environment

Factory Environment

HMX PCB's Materials Certification

on-the-spot investigation
Name Brand / Model Producer Market Price
Inner Process Wet Film
Silkscreen Ink Brand KUANGSHUN
Soldermask Ink Brand KUANGSHUN
Plating Line Potion Brand SAIBOSI
Outlayer Dry Film Brand Eternal
Base Material&Model FR-4 Kingboard
audit

HMX PCB's Manufacturing Equipment Certification

on-the-spot investigation
Item Brand / Model Producer Quantity Market Price
CNC Routing Machine TALIANG
Developing Machine KELUDI
Scrubbing Machine KELUDI
Laser Plotter WANDE
Exposure Machine WEICHUANGXIN
Etching Machine KELUDI
Gold Plating Line Manual Plating Line
Laminating Machine Taiwan Global
Imaging Machine C SUN
Drilling Machine TIMAX
audit

HMX PCB's Testing Equipment Certification

on-the-spot investigation
Item Brand / Model Producer Quantity Market Price
Testing Machine Visztek
audit

HMX PCB's Manufacturing Capabilities

on-the-spot investigation
Item Capability Details
Profile Flute Size Min: φ0.8mm; Normal: φ3.175mm
Tooling Hole Min.Milling Tooling Hole: NPTH φ1.0mm; Max.Milling Tooling Hole:φ5.5mm; PTH Hole≥φ2.0mm; NPTH Hole≥φ1.5mm
Tolerance Normal Milling Board Profile Tolerance:±0.15mm
Area Max.Milling Board Area:550 mm×610 mm
Min.Milling Board Profile Tolerance ±0.15mm
Punch Hole Capacity Board Thickness<1.0mm:Punch Slot ≥1.0×1.2mm; Board Thickness 1.0~1.2mm: Punch Slot ≥1.2×1.2mm; Board Thickness>1.2mm:Punch Slot ≥1.5×1.5mm
Min.Punch Hole Edge to Border Spacing ≥1.6mm
V-Cut Line Horizontal Deviation CNC:±0.075mm; Manual:±0.10mm
V-Cut Line Spacing Tolerance ±0.10mm
V-Cut Line Vertical Deviation CNC:±0.125mm; Manual:±0.2mm
V-Cut Remain Thickness Tolerance CNC:±0.075mm; Manual:±0.10mm
V-Cut Angle Tolerance ±5°
CNC V-Cut Max:450×600 mm; Min:100×150 mm
Manual V-Cut Max: 450×400 mm;
CNC V-Cut Border to Tooling Hole Spacing ≥5mm
Trace/Spacing Outlayer Registration Tolerance ±0.05mm
Double Side Pattern Deviation ±0.05mm
Min.Single-sided Hole Ring Base Copper≤1OZ:≥0.15mm
Min. Circuit,Pad,Copper to Border Spacing 0.25 mm
Min. Conductor to NPTH Hole Spacing 0.15mm
Min. Grid Base Copper≤H OZ: 0.25×0.35mm
Min.Trace 6mil
Surface Finish Type(Lead Free) Lead Free,ENIG,ENEPIG,Immersion Sliver,Immersion Tin,Hard Gold Plating,Soft Gold Plating, OSP
Type(Lead) HASL
Aspect Ratio 6:1
Soldermask&Silksreen Max.Solermask Plugged Hole Diameter 0.6mm
Soldermask Green,Sub-green,Black,Matt Black,Blue,Yellow,Red,White
Silksreen White,Black
Max.Peelable Blue Mask Plugged Hole Diameter 0.4mm≤Metalized Hole Size≤4mm
Resin Plugged Hole Size Range 0.3-0.6mm
Resin Plugged Hole Max.Aspect Ratio 1:1
Pad Min. Annular Ring 0.15mm
Min.BGA Pad Diameter 0.3mm
Pad Tolerance(BGA) ±20%
Aspect Ratio 6:1
Drill Location Tolerance First Drilling:±0.05mm; Second Drilling:±0.075mm
Hole Size Tolerance PTH Hole:±0.075mm; NPTH Hole:±0.05mm; Enlarge Hole Tolerance:±0.15mm
Drill Min. Drill Bit: φ0.20mmφ0.20mm; Max. Drill Bit: φ6.5mm;
Hole Wall Roughness ≤35um
Max. Area 550mm×610mm
Normal Board Layer Single-sided,Double-sided; Multilayer Hybrid Laminating(4 Layers); Multilayer (6 Layers)
Finished Copper 1/3OZ~4OZ
Board Thickness 0.4mm—4.0mm
Board Tolerance(Normal) Board Thickness≤1.0 mm Tolerance:±0.1mm Board Thickness>1.0 mm Tolerance:±10%
Laminated Board Thickness Tolerance Board Thickness 0.35-~0.6 mm:±0.10; Board Thickness 0.8mm:±0.10; Board Thickness 1.0~1.6mm:±0.10; Board Thickness 2.0mm:±0.13; Board Thickness 2.4~3.2mm:±0.15
Max. Panel Size Board Thickness≥0.8mm HASL(Lead/Lead Free):447mm×610mm Immersion Gold:406mm×457mm; Board Thickness≥0.5mm HASL(Lead/Lead Free):300mm×400mm Immersion Gold:406mm×457mm; Board Thickness≥0.25mm HASL(Lead/Lead Free):273mm×311mm Immersion Gold:364mm×311mm
Aspect Ratio 6:1
Panel Spacing CNC:1.0mm~5.0mm
Board Material Normal Tg FR4 Kingboard, CEM-3
Design Design Software GenesisUcam
Gerber File Format ger274X
Drill File Format excellon2
Test Standard Finished Inspection and Performance Criteria IPC-A-600H
Available Report Thermal Stress Test Thermal Stress Test Report
Solderability Test Solderability Test Report
Microsection Analysis Microsection Analysis Report
audit

Manufacturer Financial Statements

Financial ReportManufacturing Capacity

Development History

No Data

Latest Manufacturing Orders

  • Order No.LayersNumberBuyer’s CountryTransaction ValueTransaction Date
  • H18532AXG26 2 Layers 250 PCS SPAINjm***ez USD $280.24 2016/9/26 17:02:57

Feedback

The comments are from customers' first-hand purchasing experience!

Low Cost : 5
High Quality : 5
On-time : 5

5/5.0

Overall Rating