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FastPrint Circuit Manufacturing Ratings

FastPrint Circuit

MPN:F160501

Praise Rate

100%

Delivery Rate

100%

Complaint Rate

0%

Return Rate

0%

FastPrint Circuit's Basic Information Certification

Business Scope: Prototype,Low volume
Establish Time: 1999
Factory Area: 20000 ㎡
Monthly Capacity: 20000 ㎡
Company Type: Public company(Stock Code)
Total Staff: 8000
Certification Type:

FastPrint Circuit Manufacturer Quality Control



Samples Manufactured By FastPrint Circuit

  • Al-Substrate Mutilayer Layer Counts:2L+Al Base
Thermal conductivity:0.35-3W
Difficulty:Pressed V-CUT 
Surface Treatment:HASL
Application:LED Display

    Al-Substrate Mutilayer Layer Counts:2L+Al Base Thermal conductivity:0.35-3W Difficulty:Pressed V-CUT Surface Treatment:HASL Application:LED Display

FastPrint Circuit's Production Facilities

  • Printing Machine

    Printing Machine

  • Mountin Reflow

    Mountin Reflow

  • Laser Drilling Machine(Japan- Mitsubishi)

    Laser Drilling Machine(Japan- Mitsubishi)

  • Mechanical Drilling Machine(Japan-Hitachi)

    Mechanical Drilling Machine(Japan-Hitachi)

  • Electroplating line

    Electroplating line

  • Etching line

    Etching line

  • Vacuum Laminating Machine(Germany-Burker)

    Vacuum Laminating Machine(Germany-Burker)

  • Laser Exposure Machine(Israel- Orbotech)

    Laser Exposure Machine(Israel- Orbotech)

  • Reflow Oven Machine

    Reflow Oven Machine

  • Wave Soldering Machine

    Wave Soldering Machine

FastPrint Circuit's Manufacturing Capabilities

No.

Items

Capabilities(Delivery area <5m2)

Capabilities(Delivery area ≥5m2)

1

Material

Normal FR4

Shengyi S1141(Not recommend it to lead free assembly process)

Shengyi S1141(Not recommend it to No-Pb assembly process)

2

Normal Tg FR4(Halogen free)

Shengyi S1155

Shengyi S1155

 

3

High Tg FR4(Halogen free)

Shengyi S1165

Shengyi S1165

 

4

HDI PCB material

LDPP(IT-180A 1037&1086)、Normal PP 106&1080

LDPP(IT-180A 1037&1086)、Normal PP 106&1080

 

5

Hight CTI

Shengyi S1600

Shengyi S1600

 

6

High Tg FR4

FR408、FR408HR、IS410、FR406、GETEK、PCL-370HR;IT180A、IT-150DA;N4000-13、N4000-13EP、N4000-13SI、N4000-13EP SI;Megtron 4、Megtron 6(Panasonic);EM-827(Elite);GA-170(Grace Electron );NP-180(Nanya);TU-752、TU-662(Taiwan Union);MCL-BE-67G(H)、MCL-E-679(W)、MCL-E-679F(J)(Hitachi);VT-47(Ventec)

IT180A、GETEK、PCL-370HR、N4000-13、N4000-13EP、N4000-13SI、N4000-13EP SI

 

7

Ceramic Particle Filled Laminates

Rogers4350、Rogers4003、25FR、25N

Rogers4350、Rogers4003、25FR、25N

 

8

PTFE Laminates

Rogers series、Taconic series、Arlon series、Nelco series、Taizhou Wangling F4BK series、TP series;

Taconic (TLX、TLF、TLY、RF、TLC、TLG series);Arlon(Diclad、AD series)

 

9

PTFE PP

Taconic TP series、TPG series、TPN series、HT1.5(1.5mil)、Fastrise series

/

 

10

Hybrid laminating

Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4)

Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4)

 

11

PCB type

Rigid pcb

Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill、Semiconductor Test products.

Backplane、HDI、High multi-layer blind&buried PCB、Backdrill

12

Buildings

Blind&buried via type

mechanical blind&burried vias with less than 3 times laminating

mechanical blind&burried vias with less than 2 times laminating

13

HDI PCB

1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating

1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating

 

14

Finish treatment

Lead free

Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge

Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold fing

15

Leaded

Leaded HASL

Leaded HASL

 

16

aspect ratio

10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP)

10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP)

 

17

Max finished size

HASL Lead 22"*39";HASL Lead free 22"*24";Flash gold 24"*24";Hard gold 24"*28";ENIG 21"*27";Flash gold(electroplated gold) 21"*48";Immersion Tin 16"*21";Immersion silver 16"*18";OSP 24"*40";

HASL Lead 22"*39";HASL Lead free 22"*24";Flash gold 24"*24";Hard gold 24"*28";ENIG 21"*27";Flash gold(electroplated gold) 21"*48";Immersion Tin 16"*21";Immersion silver 16"*18";OSP 24"*40";

 

18

MIN finished size

HASL Lead 5"*6";HASL Lead free 10"*10";Flash gold 12"*16";Hard gold 3"*3";Flash gold(electroplated gold) 8"*10";Immersion Tin 2"*4";Immersion silver 2"*4";OSP 2"*2";

HASL Lead 5"*6";HASL Lead free 10"*10";Flash gold 12"*16";Hard gold 3"*3";Flash gold(electroplated gold) 8"*10";Immersion Tin 2"*4";Immersion silver 2"*4";OSP 2"*2";

 

19

PCB thickness

HASL Lead 0.6-4.0mm;HASL Lead free 0.6-4.0mm;Flash gold 1.0-3.2mm;Hard gold 0.1-5.0mm;ENIG 0.2-7.0mm;Flash gold(electroplated gold) 0.15-5.0mm;Immersion Tin 0.4-5.0mm;Immersion silver 0.4-5.0mm;OSP 0.2-6.0mm;

HASL Lead 0.6-4.0mm;HASL Lead free 0.6-4.0mm;Flash gold 1.0-3.2mm;Hard gold 0.1-5.0mm;ENIG 0.2-7.0mm;Flash gold(electroplated gold) 0.15-5.0mm;Immersion Tin 0.4-5.0mm;Immersion silver 0.4-5.0mm;OSP 0.2-6.0mm;

 

20

MAX high to gold finger

1.5inch

1.5inch

 

21

Min space between gold fingers

6mil

8mil

 

22

Min block space to gold fingers

7.5mil

7.5mil

 

23

Plating/coatin g thickness

Tin thickness

2-40μm (0.4μm on large tin area of Leaded HASL, 1.5μm on large tin area of HASL lead free)

2-40μm (0.4μm on large tin area of Leaded HASL, 1.5μm on large tin area of HASL lead free)

24

OSP

0.2-0.6μm

0.2-0.6μm

 

25

ENIG

Ni: 3-8μm; Au: 0.05-0.1μm

Ni: 3-8μm; Au: 0.05-0.1μm

 

26

Immersion Silver

0.2-0.4μm

0.2-0.4μm

 

27

Immersion Tin

≥1.0

≥1.0

 

28

Hard gold

0.1-4.0μm

0.1-2.0μm

 

29

Soft gold

0.1-4.0μm

0.1-4.0μm

 

30

ENEPIG

Ni: 3-8μm, Pd:0.05-0.15μm, Au: 0.05-0.1μm

Ni: 3-8μm, Pd:0.05-0.15μm, Au: 0.05-0.1μm

 

31

Flash gold(electroplated gold)

Ni:≥3μm ; Au: 0.025-0.1μm ;base copper≤1 oz

Ni:≥3μm ; Au: 0.025-0.1μm ;base copper≤1 oz

 

32

electroplated Gold finger

Ni:≥3μm ; Au: 0.25-1.5μm(The Thinnest point)

Ni:≥3μm ; Au: 0.25-1.5μm(The Thinnest point)

 

33

Carbon

10-50μm

10-50μm

 

34

Soldermask

0.4-0.7mil (on copper area), 0.2-0.31mil(on via pad),≥0.2mil(on circuits around the corner, just for one-time print and copper thickness<48um)

0.4-0.7mil (on copper area), 0.2-0.31mil(on via pad),≥0.2mil(on circuits around the corner, just for one-time print and copper thickness<48um)

 

35

Blue plastic

8--31.5mil

8--16mil

 

No.

Items

Capabilities(Delivery area <5m2)

Capabilities(Delivery area ≥5m2)

36

hole

MAX thickness of mechanical hole 4mil/6mil/8mil

31.5mil/59mil/100mil

24mil/47mil/63mil

37

Min laser drilling size

4mil

4mil

 

38

Max laser drilling size

6mil

6mil

 

39

Finshed mechanical hole size

4-244mil(corresponding drilling tool size 6-248mil)

5-244mil(corresponding drilling tool size 8-248mil)

 

40

A、Min finished hole size for PTFE material and hybrid PCB is 10mil(corresponding drilling tool size 14mil)

A、Min finished hole size for PTFE material and hybrid PCB is 12mil(corresponding drilling tool size 16mil)

   

41

B、Max finished hole size for blind & buried via is 12mil(corresponding drilling tool size 16mil)

B、Max finished hole size for blind & buried via is 12mil(corresponding drilling tool size 16mil)

   

42

C、Max finished hole size for via-in-pad pluged with solder mask is 18mil(corresponding drilling tool size 21.65mil

C、Max finished hole size for via-in-pad pluged with solder mask is 12mil(corresponding drilling tool size 16mil)

   

43

D、Min connecting hole size is 14mil(corresponding drilling tool size is 18mil)

D、Min connecting hole size is 14mil(corresponding drilling tool size is 18mil)

   

44

E、Min half-hole(pth)size is 12mil(corresponding drilling tool size is 16mil)

E、Min half-hole(pth)size is 12mil(corresponding drilling tool size is 16mil)

   

45

MAX aspect ratio for Hole plate

20:1(hole diameter>8mil)

10:1

 

46

Max aspect ratio for laser via filling plating

1:1(Dpeth included copper thickness)

0.9:1(Dpeth included copper thickness)

 

47

Max aspect ratio for mechanical depth- control drilling board(Blind hole drilling depth/blind hole size)

1.3:1(drilling tool size≤8mil),1.15:1(drilling tool size≥10mil)

0.8:1(drilling tool size≥10mil)

 

48

Min. depth of Mechanical depth- control(backdrill)

8mil

8mil

 

49

Min gap between hole wall and conductor (None blind and buried via PCB)

5.5mil(≤8L),6.5mil(10-14L),7mil(>14L)

7mil(≤8L),9mil(10-14L),10mil(>14L)

 

50

Min gap between hole wall conductor (Blind and buried via PCB)

7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating)

8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating)

 

51

Min gab between hole wall conductor
(Laser blind hole buried via PCB)

7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2)

7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2)

 

52

Min space between laser holes and conductor

5mil

6mil

 

53

Min space bwteen hole walls in different net

10mil

10mil

 

54

Min space bwteen hole walls in same net

6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB)

6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB)

 

55

Min space bwteen NPTH hole walls

8mil

8mil

 

56

Hole location tolerance

±2mil

±2mil

 

57

NPTH tolerance

±2mil

±2mil

 

58

Pressfit holes tolerance

±2mil

±2mil

 

59

Countersink depth tolerance

±6mil

±6mil

 

60

Countersink hole size tolerance

±6mil

±6mil

 

61

Pad(ring)

Min Pad size for laser drillings

10mil(for 4mil laser via),11mil(for 5mil laser via

10mil(for 4mil laser via),11mil(for 5mil laser via

62

Min Pad size for mechanical drilling

16mil(8mil drillings)

16mil(8mil drillings

 

63

Min BGA pad size

HASL:10mil, LF HASL:12mil, other surface technics are 7mi

HASL:10mil, LF HASL:12mil, other surface technics are 10mil(7mil is ok for flash gold

 

64

Pad size tolerance(BGA)

±1.2mil(pad size≤12mil);±10%(pad size≥12mil)

±1.5mil(pad size≤10mil);±15%(pad size>10mil)

 

65

Internal Layer

1/2OZ:3/3mil

1/2OZ: 3/3mil

66

1OZ: 3/4mil

1OZ: 3/4mil

   

67

2OZ: 4/5mil

2OZ: 4/5.5mil

   

68

3OZ: 5/8mil

3OZ: 5/8mil

   

69

4OZ: 6/11mil

4OZ: 6/11mil

   

70

5OZ: 7/13.5mil

5OZ: 7/14mil

   

71

6OZ: 8/15mil

6OZ: 8/16mil

   

72

7OZ: 9/18mil

7OZ: 9/19mil

   

73

8OZ: 10/21mil

8OZ: 10/22mil

   

74

9OZ: 11/24mil

9OZ: 11/25mil

   

75

10OZ: 12/27mil

10OZ: 12/28mil

   

No.

Items

Capabilities(Delivery area <5m2)

Capabilities(Delivery area ≥5m2)

76

Width/Space

External Layer

1/3OZ:3/3mil

1/3OZ:3.5/4mil

77

1/2OZ:3.5/3.5mil

1/2OZ:3.9/4.5mil

   

78

1OZ: 4.5/5mil

1OZ: 4.8/5.5mil

   

79

1.43OZ(positive):4.5/6

1.43OZ(positive):4.5/7

   

80

1.43OZ(negative ):5/7

1.43OZ(negative ):5/8

   

81

2OZ: 6/7mil

2OZ: 6/8mil

   

82

3OZ: 6/10mil

3OZ: 6/12mil

   

83

4OZ: 7.5/13mil

4OZ: 7.5/15mil

   

84

5OZ: 9/16mil

5OZ: 9/18mil

   

85

6OZ: 10/19mil

6OZ: 10/21mil

   

86

7OZ: 11/22mil

7OZ: 11/25mil

   

87

8OZ: 12/26mil

8OZ: 12/29mil

   

88

9OZ: 13/30mil

9OZ: 13/33mil

   

89

10OZ: 14/35mil

10OZ: 14/38mil

   

90

Width tolerance

≤10mil:+/-1.0mil

≤10mil:+/-20%

 

91

>10mil:+/-1.5mil

>10mil:+/-20%

   

92

Soldermask

MAX drilling tool size for via filled with Soldermask (single side)

35.4mil

35.4mil

93

Soldermask color

Green matte/glossy, Yellow, Black, Blue, Red, White, Purple

Green matte/glossy, Yellow, Black, Blue, Red, White, Purple

 

94

Silkscreen color

White, Yellow, Black

White, Yellow,Black

 

95

MAX hole size for via filled with Blue glue aluminium

197mil

197mil

 

96

Finish hole size for via filled with resin

4-25.4mil

4-25.4mil

 

97

Max aspect ratio for via filled with resin board

12:1

8:1

 

98

Min width of soldermask bridge

Base copper≤0.5 oz、Immersion Tin: 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area)

Base copper≤0.5 oz、Immersion Tin: 7.5mil(Black), 5.5mil(Other color) , 8mil( on copper area)

 

99

Base copper≤0.5 oz、Finish treatment not Immersion Tin: 5.5 mil(Black,extremity 5mil), 4mil(Other color,extremity 3.5mil) , 8mil( on copper area)

Base copper≤0.5 oz、Finish treatment not Immersion Tin: 5.5 mil(Black,extremity 5mil), 4mil(Other color,extremity 3.5mil) , 8mil( on copper area

   

100

Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area)

Base coppe 1 oz: 4mil(Green), 5mil(Other color) , 5.5mil(Black,extremity 5mil),8mil( on copper area)

   

101

Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area)

Base copper 1.43 oz: 4mil(Green), 5.5mil(Other color) , 6mil(Black), 8mil( on copper area

   

102

Base copper 2 oz-4 oz: 6mil, 8mil( on copper area)

Base copper 2 oz-4 oz: 6mil, 8mil( on copper area)

   

103

Routing

Min space of the V-CUT does not reveal the copper ( Central Line of v-cut to internal/external circuits,H means board thickness)

H≤40mil: 12mil(20°mean V-CUT angle),13mil(30°),14.6mil(45°

H≤40mil: 12mil(20°mean V-CUT angle),13mil(30°),14.6mil(45°

104

40<H≤63mil: 14.2mil(20°),16mil(30°),20mil(45°

40<H≤63mil: 14.2mil(20°),16mil(30°),20mil(45°

   

105

63<H≤94.5mil: 16.5mil(20°), 20mil(30°),25.2mil(45°

63<H≤94.5mil: 16.5mil(20°), 20mil(30°),25.2mil(45°

   

106

94.5<H≤118.1mil: 18.5mil(20°),23.2mil(30°),30.3(45°

94.5<H≤118.1mil: 18.5mil(20°),23.2mil(30°),30.3(45°

   

107

V-CUT symmetrical tolerance

±4mil

±4mil

 

108

MAX V-CUT lines

100

100

 

109

V-CUT angle tolerance

±5°

±5°

 

110

V-CUT angle

20、30、45°

20、30、45°

 

111

Gold finger bevelling

20、30、45、60°

20、30、45、60°

 

112

Gold finger bevelling tolerance

±5°

±5°

 

113

Min space of gold finger chamfering noninterference tab

236mil

275.6mil

 

114

Min gap between the side of gold finger and the shape edge line

8mil

10mil

 

115

Depth tolerance of depth-control groove milling

±4mil

±4mil

 

116

routing tolerance (edge to edge)

±4mil

±4mil

 

117

Min tolerance for routing slot(PTH)

width/length tolerance ±5mil

width/length tolerance ±5mil

 

118

Min tolerance for routing slot (NPTH)

width/length tolerance ±4mil

width/length tolerance ±4mil

 

119

Min tolerance for drilling slot(PTH)

width tolerance ±3mil;Length/width≥2, length tolerance ±3mil; Length/width<2, length tolerance ±4mil

width tolerance ±3mil;Length/width≥2, length tolerance ±3mil; Length/width<2, length tolerance ±4mil

 

120

Min tolerance for drilling slot (NPTH)

width tolerance ±2mil;Length/width≥2, length tolerance is±2mil; Length/width<2,width and length tolerance ± 
3mil

width tolerance ±2mil;Length/width≥2, length tolerance is±2mil; Length/width<2,width and length tolerance ±3mi

 

No.

Items

Capabilities(Delivery area <5m2)

Capabilities(Delivery area ≥5m2)

121

Local mixed pressure

Min gap between mechanical hole wall and conductor (Local mixed pressure area)

12mil(local 10mil)

12mil(local 10mil)

122

Min gap between mechanical hole wall and the junction of local mixed pressure

10mil

10mil

 

123

Metal- substrate PCB

Layer counts

1-8L(Al-substrate、Cu-substrate);2-24L(Heatsink、Sweat bonding、Buried metal);1-2L(Ceramic-substrate)

1-8L(Al-substrate、Cu-substrate);2-24L(Heatsink、Sweat bonding、Buried metal);1-2L(Ceramic-substrate)

124

PCB size (Finished)

Max: 24"*24", Min: 0.2"*0.2" (Al-substrate、Cu-substrate、Heatsink、Sweat bonding、Buried metal)

Max: 24"*24", Min: 0.2"*0.2" (Al-substrate、Cu-substrate、Heatsink、Sweat bonding、Buried metal)

 

125

MAX PCB size(Ceramic-substrate PCB)

4" * 4"

4" * 4"

 

126

PCB thickness(Finished)

0.02"-0.2"

0.02"-0.2"

 

127

Copper thickness(Finished)

0.5-10 oz

0.5-10 oz

 

128

Metal thickness

0.02"-0.2"

0.02"-0.2"

 

129

Metal material type

AL:1100/1050/2124/5052/6061;Cu:c11000; Iron

AL:1100/1050/2124/5052/6061;Cu:c11000; Iron

 

130

Min finished hole size&tolerance

NPTH: 20±2mil; PTH: 40±4mil(for Al-substrate、Cu-substrate)、8±4mil(for Heatsink、Sweat bonding、Buried metal)

NPTH: 20±2mil; PTH: 40±4mil(for Al-substrate、Cu-substrate)、8±4mil(for Heatsink、Sweat bonding、Buried metal)

 

131

Dimension tolerance

±1.2mil

±2mil

 

132

PCB partial surface treatment

Leaded HASL/Lead free HASL; OSP; ENIG; ENEPIG ; Plating(Ni)Soft/Hard gold;Plating Sn

Leaded HASL/Lead free HASL; OSP; ENIG; ENEPIG ; Plating(Ni)Soft/Hard gold;Plating Sn

 

133

Metal partial surface treatment

Cu:Plating Ni&Au ; Al:Anodic oxidation、Hard anodic oxidation coating、Chemical passivation; Physical treatment:Sandblasting、Wire drawing

Cu:Plating Ni&Au ; Al:Anodic oxidation、Hard anodic oxidation coating、Chemical passivation; Physical treatment:Sandblasting、Wire drawing

 

134

Material

Metal PCB:Totking(T-110、T-111)、Ventec(VT-4A1、VT-4A2、VT-4A3)、Laird(1KA04、1KA06);Bergquist(MP06503、HT04503)、TACONIC(TLY-5、TLY-5F)

Metal PCB:Totking(T-110、T-111)、Ventec(VT-4A1、VT-4A2、VT-4A3)、Laird(1KA04、1KA06);Bergquist(MP06503、HT04503)、TACONIC(TLY-5、TLY-5F)

 

135

Thermal glue thickness (dielectric layer)

3-6mil

3-6mil

 

136

Buried copper block size

0.118" * 0.118" -- 2.756" * 3.15"

0.118"*0.118" -- 2.756"*3.15"

 

137

Buried copper block drop tolerance

±1.6mil

±1.6mil

 

138

Min gap between Buried copper block and hole wall

12mil

12mil

 

139

Thermal conductivity

0.3-3w/m.k(Heatsink、Al-substrate、Cu-substrate);8.33w/m.k(Sweat bonding);0.35-3w/m.k(Buried metal);24-180 w/m.k(Ceramic-substrate)

0.3-3w/m.k(Heatsink、Al-substrate、Cu-substrate);8.33w/m.k(Sweat bonding);0.35-3w/m.k(Buried metal);24-180 w/m.k(Ceramic-substrate)

 

140

Others

Max finished copper thickness to internal&external layer

Internal layer:10 oz; External layer:11 oz

Internal layer:4oz; External layer:5 oz

141

finished copper thickness to external layer

base copper 1/3 oz、0.5 oz:≥35.8μm(reference value:35.8-42.5μm);≥40.4μm(reference value:40.4-48.5μm)

base copper 1/3 oz、0.5 oz:≥35.8μm(reference value:35.8-42.5μm);≥40.4μm(reference value:40.4-48.5μm)

 

142

base copper 1 oz、1.43 oz、2 oz:≥55.9μm;≥70μm;≥86.7μm

base copper 1 oz、1.43 oz、2 oz:≥55.9μm;≥70μm;≥86.7μm

   

143

base copper 3oz、4 oz:≥117.6μm;≥148.5μm

base copper 3oz、4 oz:≥117.6μm;≥148.5μm

   

144

Layer count

1-40L

1-20L

 

145

PCB thickness

8 - 275.6mil(No Soldermask);15.7-275.6mil(Have Soldermask)

11.8-196.85mil(No Soldermask);15.7-196.85mil(Have Soldermask)

 

146

PCB thickness tolerance(Normal)

Thickness>40mil: ±10% ;Thickness≤40mil: ±4mil

Thickness>40mil: ±10% ;Thickness≤40mil: ±4mil

 

147

PCB thickness tolerance(Special )

Thickness≤80mil: ±4mil ;80mil<Thickness≤120mil: ±6mil

Thickness≤80mil: ±10% ;80mil<Thickness≤120mil: ±6mil

 

148

Min finished PCB size

0.4" * 0.4"

2.0" * 4.0"

 

149

Max finished PCB size

23×35 inch(2L) ; 22.5*33.5 inch(4L);22.5*30inch(≥6L)

20×30 inch(2L) ; 22.5*30 inch(4L);16.5*22.5inch(≥6L)

 

150

ionic soil

≤1ug/cm2

≤1ug/cm2

 

151

Min bow&twist

0.1%(This ability request same laminated plate type, symmetry laminated construction, the difference of symmetry layer Copper area within 10%, uniformity wiring , excluding the large area of copper and base material ,haven't plate and single panel, and the long side size≤ 21 inch)

0.75%

 

152

Impedance tolerance

±5ohm(<50ohm), ±10%(≥50ohm)

±5ohm(<50ohm),±10%(≥50ohm)

 

153

Laser blind via size with filling plating

4-5mil(priority 4mil)

4-5mil(priority 4mil)

 

154

Max aspect ratio for laser via filling plating

1:1(Depth included copper thickness)

1:1(Depth included copper thickness)

 

Latest Manufacturing Orders

  • Order No.LayersNumberBuyer’s CountryTransaction ValueTransaction Date
  • H18241ASG31 6 Layers 10 PCS SPAINju***il USD $611.31 2016/8/10 17:03:36
  • H17460AST12 4 Layers 10 PCS THAILANDri***za USD $1378 2016/7/7 20:16:22

Feedback

The comments are from customers' first-hand purchasing experience!

Low Cost : 5
High Quality : 5
On-time : 5

5/5.0

Overall Rating