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FASTPCB Manufacturing Ratings

FASTPCB

MPN:J160801

Praise Rate

100%

Delivery Rate

100%

Complaint Rate

0%

Return Rate

0%

Audited By

Name: LiangChuan(Factory Auditor)

Duty: ALLPCB inspects the manufacturers for you by the on-the-spot investigation of the fabrication capacity, quality control, facilities, etc. ALLPCB factory auditor verifies the following information with the criteria of impartiality.

FASTPCB's Basic Information Certification

on-the-spot investigation
Business Scope: Prototype,Low volume
Best For: 1~24layer
Establish Time: 2004
Factory Area: 13109 ㎡
Monthly Capacity: 10000 ㎡
Company Type: Public company(Stock Code)
Total Staff: 610
QA: 20
Design Engineer: 50
Production Engineer: 15
Certification Type:

FASTPCB Manufacturer Quality Control

on-the-spot investigation
Picture Certification Name Certified By Certificate No. Business Scope Availiable Date --- Expired Date

ISO 14001:2004

IAF

 

Double sided and multilayer printed circuit board manufacture

 

ISO 9001:2008/GB/T 19001-2008

IAF

 

Double sided and multilayer printed circuit board manufacture

 

ISO/TS 16949:2009

IAFT

151691-2014-AQ-RGC-IAFT

Double sided and multilayer printed circuit board manufacture

7th November,2014 ---
6th November,2017

UL

 

ZPMV2.E300750

Wiring, Printed-Component

 

Samples Manufactured By FASTPCB

FASTPCB's Manufacturer Audit

on-the-spot investigation

All these photos were taken by the manufacturer auditor to ensure the reliability.

Brushing Machine

Brushing Machine

Automatic Edging Machine

Automatic Edging Machine

Film Room

Film Room

Sample Display Area

Sample Display Area

Inner Circuit Etching Machine

Inner Circuit Etching Machine

Automatic V-CUT Machine

Automatic V-CUT Machine

Finished Products Cleaning

Finished Products Cleaning

Lamination Targeting Machine

Lamination Targeting Machine

Material Warehouse

Material Warehouse

FQC Test

FQC Test

Ink Jet Printer

Ink Jet Printer

SoldermaskSilkscreen

SoldermaskSilkscreen

Soldermask Brushing Machine

Soldermask Brushing Machine

Outlayer Etching Machine

Outlayer Etching Machine

Circuit Exposure Machine

Circuit Exposure Machine

Circuit Laminator

Circuit Laminator

Circuit Brushing Machine

Circuit Brushing Machine

Drilling

Drilling

Potion Area

Potion Area

Physics Laboratory

Physics Laboratory

SMT

SMT

Packing

Packing

Film Test

Film Test

Plating Line

Plating Line

Finished Products

Finished Products

Flying Probe Test

Flying Probe Test

Molding

Molding

AOI Test

AOI Test

Semi-finished Products Inspection

Semi-finished Products Inspection

Automatic Copper Plating Line

Automatic Copper Plating Line

Laminating

Laminating

Cutting

Cutting

Chemistry Laboratory

Chemistry Laboratory

Factory Environment

Factory Environment

FASTPCB's Materials Certification

on-the-spot investigation
Name Brand / Model Producer Market Price
Inner Process Du Pont Dry Film
AsahiKASEI
Silkscreen Ink Brand KUANGSHUN
Soldermask Ink Brand KUANGSHUN
TAIYO
Plating Line Potion Brand ROHMHAAS
Outlayer Dry Film Brand Du Pont
Base Material&Model NANYA
SHENGYI
ITEQ
audit

FASTPCB's Manufacturing Equipment Certification

on-the-spot investigation
Item Brand / Model Producer Quantity Market Price
CNC Routing Machine TALIANG
Ink Jet Printer Orbotech
Developing Machine YUZHOU
Scrubbing Machine YUZHOU
Laser Plotter Orbotech
Exposure Machine C SUN
Etching Machine YUZHOU
DES Line YUZHOU
Gold Plating Line Manual Plating Line
PTH Line Automatic PTH Line
Laminating Machine Taiwan Global
Imaging Machine C SUN
Film Machine C SUN
Drilling Machine Schmoll
audit

FASTPCB's Testing Equipment Certification

on-the-spot investigation
Item Brand / Model Producer Quantity Market Price
AVI Orbotech
ROHS Tester HUARUI
Insulation Resistance Test Agilent
X-RAY Machine ZHENGYE
AOI Orbotech
Testing Machine CHUANGWEILI
audit

FASTPCB's Manufacturing Capabilities

on-the-spot investigation
Item Capability Details
Drill Drilling Cutter Diameter 0.2mm-6.3mm
High Frequency Board Min.Drilling Hole 0.25mm
Min.Non-metal Hole of First Drilinng 0.5mm
Max.Aspect Ratio 10:1
Max.Dimension 20×24 inch
Min.Drill to Conductor Spacing 8mil(≤6 Layers);10mil(≤14 Layers)
Min.Drill to Conductor Spacing(Blind Hole) 9mil(Once Laminating);10mil(Twice/Three times Laminating)
Min.Hole Wall Spacing in Same Circuit 6mil
Min.Hole Wall Spacing in Different Circuit 12 mil
Non-metal Hole Wall Spacing 8 mil
Hole Position Precision ±3 mil
Plug-in Hole Diameter Tolerance(Normal Metallized Hole) ±6 mil
Drill Diameter Tolerance 0.04mm
Slot Hole Diameter Tolerance ±0.15mm(Long Side)、±0.10mm(Short Side)
Slot Cutter Diameter 0.60--1.20mm
Slot Length: Slot Width 1.8:1
Stepped/Tapered Hole Depth Tolerance ±0.2mm
Stepped/Tapered Hole Diameter Tolerance ±0.15mm
Stepped/Tapered Hole Angle 45°、82°、90°
Stepped/Tapered Hole Angle Tolerance ±10°
Available Report Thermal Stress Test Thermal Stress Test Report is available
Impedance Control Test Impedance Control Test Report is available
Withstanding Voltage Test Withstanding Voltage Test Report is available
Ionic Contamination Test Ionic Contamination Test Report is available
Solderability Test Solderability Test Report is available
Microsection Analysis Microsection Analysis Report is available
Insulation Resistance Test Insulation Resistance Test Report is available
Peel Strength Test Peel Strength Test Report is available
Test Standard Finished Product Inspection and Performance Criteria IPC-A-600H IPC-A-610E GB4588
Test Method IPC-TM-650
Test Min. Test Point to Border Spacing 0.5mm
Test Conduction Resistance 10Ω
Min.Test Open-circuit Resistance
Max.Test Insulation Resistance 100 MΩ
Test Voltage 200V
Max. Test Current 200 MA
Max.Test Dimension 18*24 inch
Ionic Contamination 1.56μg NaCl.Eq/cm2
Warp Capacity Symmetric Structure≤0.75%
Resistance Tolerance ±10%
Test Equipment TektronixDSA8200
Test Standard ±10%
Test Frequency Range 0-20GHZ
Profile Profile Dimension 21×24inch
Profile Precision(Side to Side) ±6mil
Min.Milling Cutter Diameter 0.8mm
Min. Arc Inner Angle Radius 0.5mm
Profile Milling Cutter Diameter 0.80mm、1.0mm、1.20mm、1.60mm、2.00mm
Gold Finger Chamfer Angle 20-60°
Gold Finger Chamfer Angle Tolerance ±5°
Gold Finger Chamfer Depth Tolerance ±0.20
Milling Slot Size Tolerance ±0.15mm
Stepped Hole/Slot Depth Tolerance ±0.15mm
Stepped Hole/Slot Diameter Tolerance ±0.15mm
Second Dilling Hole Diameter Tolerance ≥3(eg:±2mil、+3/0mil)
Normal Board Brige+Stamp Hole Design 4 Holes, Hole Size:0.6-1.0mm, Brige:≤3inch
Surface Finish(Coating)Thickness HASL/HASL lead free 40-1000u"
OSP 8-20u"
ENIG Ni 90-236u", Au 1-3u", Thick Au 5-8u"
Immersion Sliver 5-15u"
Immersion Tin 30-50u"
Soft Gold Plating 1-3u"
ENEPIG Ni 90-236u",Pd 1-8u",Au 1-3u"
Gold Finger Ni:100-400u",Au:15-30u"
Carbon Ink ≥12um
Green Ink Circuit Corner≥5um, Circuit Surface≥10um
Peelable Soldermask 0.2mm
Surface Finish Type(HASL Lead Free) HASL Lead Free, ENIG, Immersion Sliver, Immersion Tin
Type(HASL) HASL
Aspect Ratio 10:1
Max.Dimension 500mm*900mm
Min.Dimension 30mm*50mm
Board Thickmess 0.4mm-6.5mm
Max.Gold Finger Height 3mm
Min.Gold Finger Spacing 0.1mm
Min.Subsectional Gold Finger Spacing 0.15mm
Soldermask&Silksreen Max.Drill Diameter of Solermask Plugged Hole 0.6mm
Soldermask Green,Sub-green,Black,Matt Black,Blue,Yellow,Red,White
Silksreen White,Black
Max.Peelable Blue Mask Plugged Hole Diameter 0.4mm≤Metalized Hole Size≤4mm
Resin Plugged Hole Size Range 0.2-0.6mm
Max.Resin Plugged Hole Aspect Ratio 1:1
Min.Silkscreen to Solder Brige Spacing Silksreen Width≥8mil
Min.Silkscreen to Solder Brige Spacing Finished Copper(≤1.5oz) ≥4mil
Min.Silkscreen to Solder Brige Spacing Finished Copper(2oz) ≥5mil
Min.Silkscreen to Solder Brige Spacing Finished Copper (3oz) ≥6mil
Min.Silkscreen to Solder Brige Spacing Finished Copper(4OZ) ≥7mil
Pad Min.Inner and Outlayer Pad Size of Mechanical Hole 0.2mm
Min.BGA Pad Diameter 0.2mm
Pad Tolerance(BGA) ±20%
Aspect Ratio 10:1
Trace/Spacing Inner Layer 0.5oz Copper:3.5/3.5; 1oz Copper:4/4; 2oz Copper:6/6; 3oz Copper:10/10; 4oz Copper:12/12
Outlayer 0.5oz Copper:3/3; 1oz Copper:3.5/3.5 ; 2oz Copper:7/7; 3oz Copper:10/10; 4oz Copper:15/15
Trace Tolerance >5.0 mil: ±20%; ≤5.0 mil: ±1.0mil
Normal Board Layer Single Sided, Double Sided, Hybrid Multilayer, Multilayer(40 Layers)
Board Thickness 0.4mm—6.5mm
Board Thickness Tolerance(≤1.0mm) ±0.1
Board Thickness Tolerance(>1.0mm) ±10%(1.0mm<Board Thickness ≤2.4mm); ±8%(Board Thickness>2.4mm)
Max.Dimension 23.5×26 inch
Min.Dimension 6×6 inch
Lamination Multi-laminated Blind Hole Board Three-time Mechanical Blind Hole
Product Type Rigid Buried Capacitance, Buried Resistance, Back Drill Board, Thick Copper Blind Hole, Stepped Slot, Hybrid Laminating, Partial Copper Embeded, Half Hole, Via in Pad, HDI, Rigid-flex, PTFE, High Frequency Hybrid Laminating, Rigid Polyimide
Board Material Arlon AD350, AR1000, 25N/25FR, 33N, Diclad527, 85N, DiClad? 880, CLTE, CuClad? 6700
Rogers Ro4350, Ro4350B, Ro4003, Ro4003C, RT6002, RT58880, TMM
TACONIC RF35, TLP, Fastrise27
High TG FR4 Shengyi S1141 17o, Prepreg S0401
Normal Tg FR4(Halogen-free) Shengyi S1155, Prepreg S0155
High Tg FR4(Halogen-free) Shengyi S1165, Prepreg S0615
Prepreg Type Shengyi S1170,Prepreg S070,Shengyi S1000-2
Normal Prepreg Specifications 7628 ( 0.185mm ), 2116 ( 0.105mm ),1080 (0.075mm), 3313( 0.095mm), RO4403(4mil), RO4350(4mil)
Design Design Software GenesisUcam
Gerber File Format ger274X
Drill File Format excellon2
audit

Manufacturer Financial Statements

Financial ReportManufacturing Capacity

Development History

  • 2016
    OHSAS18001 Occupational Health and Safety Management System Certification in 2016Fast-PCB completes the transformation and prepares for the preliminary work of listing in NEEQ
  • 2015
    The Phase-II Plant was constructed and started operating in 2015
  • 2014
    Elected as the Governing Entity of China Shanghai Electronics Packaging and Circuits Association(SEPCA) in 2014Canada UL Product CertificationISO/TS16949 Automotive Quality Management System Certification
  • 2013
    The construction of Phase-II Plant was started in 2013The construction of Cleaner Production Engineering of Phase-I Plant was started(sewage treatment system)
  • 2012
    Rated as the Technical Centre of Jiading District, Shanghai in 2012 Rated as Small Giant Enterprise of Jiading District, Shanghai, 201807Phase-I Plant was reconstructed
  • 2011
    Rated as (2011) Second Outstanding National Enterprise of China Printed Circuit Association in 2011
  • 2010
    Rated as the High-Tech Enterprise in 2010 and passed the reexamination in 2013
  • 2009
    ISO14001 Environment Management System Certification in 2009
  • 2008
    GJB 9001B-2009 Weapons and Equipment Quality Management System Certification in 2008
  • 2007
    The United States UL Product Certification in 2007Passed the SGS Product Reach and RoHS Test
  • 2005
    ISO9001 Quality Management System Certification in 2005
  • 2004
    Shanghai Fast-PCB Circuit Technology Corp. Limited was established in 2004

Feedback

The comments are from customers' first-hand purchasing experience!

Low Cost : 5
High Quality : 5
On-time : 5

5/5.0

Overall Rating

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